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| Testing
Service |
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| Full Range
of Test Service |
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Production Testing :
•Wafer Sort (CP)
•Final Test
•Lead/Ball/Mark Scan
•Dry-Bake & Packing
•Engineering Services
•IC Characterization program develop
Back-End Turn-Key / Subcontract :
•Assembly，Burn In，Marking, Dice Saw,
tape & real |
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| Engineering
Service
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- Test strategy consultant
- Test program development
- Test platform conversion
- Test performance optimization
- Multi site test upgrade
- Detail effective low yield analysis
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| Developing
Test Capability |
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-
High speed up to 200MHz
(400Mbit available)
•
Ixxx -
133MHz
•
Sxxx -
Network Processor : 200MHz
•
Pxxxx - USB2.0 : 480M bit
•
Axxx -
LVDS controller : 560M bit
•
Fx -
Giga bit transceiver controller : 1.25G bit
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| Currently
Available Solution |
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| PACKAGE |
|
Pin
count |
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QFN 4x4 |
24 |
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QFN 4x6 |
40 |
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QFN 4.5x6.5 |
46 |
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QFN 5x5 |
28 |
32 |
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QFN 6x6 |
48 |
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QFN 7x7 |
32 |
48 |
64 |
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QFN 8x8 |
56 |
68 |
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| PACKAGE |
|
Pin
count |
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QFP 14x20 |
64 |
80 |
100 |
128 |
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QFP 28x28 |
160 |
208 |
256 |
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QFP 24x24 |
208 |
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LQFP 20x20 |
144 |
160 |
176 |
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LQFP 24x24 |
160 |
176 |
216 |
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LQFP 14x20 |
100 |
128 |
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T/LQFP 7x7 |
32 |
48 |
64 |
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T/LQFP10x10 |
44 |
64 |
80 |
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LQFP 14x14 |
100 |
128 |
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| PACKAGE |
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Pin
count |
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BGA 4.5x6.5 |
54 |
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BGA 7x7 |
81 |
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BGA 8x8 |
64 |
100 |
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BGA 9x9 |
100 |
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BGA 10x10 |
144 |
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BGA 11x11 |
186 |
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BGA 12x12 |
144 |
256 |
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BGA 13x13 |
308 |
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BGA 13x15 |
165 |
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BGA 14x22 |
119 |
209 |
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BGA 15x15 |
278 |
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BGA 15x17 |
165 |
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BGA 16x16 |
100~209 |
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BGA 17x17 |
256 |
208 |
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BGA 20x20 |
176 |
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BGA 23x23 |
300 |
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BGA 27x27 |
256~380 |
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BGA 35x35 |
388~436 |
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| Testing
Equipment Forecast |
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|
Time |
2023 |
2024 |
Total |
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Tester Model |
Q2 |
Q3 |
Q4 |
Q1 |
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Credence SC Series |
35 |
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35 |
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Inovys ZFP |
1 |
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1 |
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Credence D-10 |
5 |
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5 |
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Chroma 3600 |
6 |
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6 |
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Chroma 3360P |
9 |
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9 |
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LTX Fusion CX |
1 |
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1 |
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ASL1000 |
4 |
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4 |
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TR6850 |
5 |
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5 |
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S50 |
9 |
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9 |
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Total Tester |
75 |
75 |
75 |
75 |
75 |
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ESI-9350(LaserTrim) |
2 |
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|
2 |
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Handler |
35 |
2 |
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|
37 |
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Prober |
22 |
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|
22 |
Total
(Handler&Prober) |
59 |
61 |
61 |
61 |
61 |
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| Testing
Equipment list |
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Tester
& Credence SC Series
•50/85MHz digital clock rate
•256 ( Max 304 ) I/O Channels
•2M/4M Vector Memory
•128Mb Scan Memory
•Analog pin card
& Inovys ZFP
•Speed: 50Mhz / 100Mhz
•Pin Count: 512Pin.(64*8)
•Pattern memory: 16M
•DPS 105ch,(0~3V 16A),(0~6V 2.5A),(0~16V 0.2A)
•PMU 8ch,-2~5V range,+-40mA range
& Credence D-10
•100MHz clock rate
•200Mbps data rate (Max.)
•288 / 384 digital channel (576 channel Max.)
•16M pattern memory / 768M max scan depth
(1
pin/board)
•16 sets DPS
•AWG : 8 signal-ended or 4
differential
with
20bits / 300Msps
•DIG : 4 differential with
16bits / 2.5Msps
and 14bits /
100Msps
& Chroma 3600
•50/100MHz / 256Pin
•16M Pattern memory
•Over timer accuracy 850ps
•DPS 8ch (+/- 8V, 2A)(+/- 16V, 0.8A)
•PMU 4ch
•ADDA 4ch /16bit
•ALPG 12X, 12Y, 32D
& Chroma 3360P
•Test rate 50MHz 256pin (32*8)
•Over timing accuracy +/- 1.25ns
•8M pattern memory (option 16M)
•DPS 8ch (+/-10V, 2A)
•Option UVI 16ch (+/- 10V, 500mA)
•PMU 16ch
•PPMU per pin
•ALPG 16X, 16Y, 16D
•ADDA 4AWG(16bit) / 4Digizer
(16bit)
& LTX Fusion CX
•80MHz clock rate
•Patern Gen. rate 33MHz
•128 digital channel (8M pattern memory)
•OVI 8ch (+/- 16V, 1A)
•VI16B 16ch (+16 to - 4V, 100mA)
•AWG：2ch with 14bits / 25Msps
•DIG：2ch with 14bits / 25Msps
•RF16：16ports (10MHz to 6GHz)
& ASL1000
•14Mhz clock rate
•Instrument list：
OVI：±15V range
DVI：±45V force range, differential
voltage measure capable
MUX：Voltage range 200V / 500V
TMU：Timing range of 2s to 10ns
PV3：Fully floating output
DDD：320 KHz to 14 MHz
ACS：Simple waveform generator
& TR6850
•OVC：8 ch, ±20V renge, ±200mA range
•QVC：4 ch, ±45V renge, ±1A range
•PEB32：32 ch, 33Mhz, 4M pattern Memory,
Level set -2~8V ±40mA range
•TMU：4 Set (A,B,HiZ,Trig 4ch/set),
625ps resolution, 80ch UR control bit
& S50
•LOGIC *1：
64ch (8PMU), 50Mhz, 17M Pattern memory,
-2~7V range.2DPS, 10V range, 1.73A range.
1TMU, -2~10V range, 5ns resolution.32CBIT,
5V, 60mA.
•OPM *3：
8 ch, -15~38V renge, ±1A range.32CBIT,
5V, 60mA.
& ESI-9350(Laser Trim)
•Wavelength：1.3 μm (IR)
•Maximum Laser Pulse Equalization Rep Rate：6 KHz
•Programmable Spot Size：2.3 μm ~ 6.0 μm
•Maximum setting of Energy level per pulse：6.0 μj
•Size of Wafer：150 mm ( 6”) & 200 mm ( 8”)
Handler
& NS-5000, NS-6000
•Package type：QFP, TQFP, TSOP, SOP,
PLCC, BGA, µ
BGA, CSP
•Temperate：50 to 90oC (Option：90 to 130oC)
•Up to 2 test site handling
•Superiority throughput and reliability
&Hitachi
•Package type：QFP, TQFP, TSOP, SOP,
PLCC, BGA, µ
BGA, CSP
•Temperate：50 to 90oC(Option：90 to 130oC)
•Up to 4 test site parallel testing
•Superiority throughput and
reliability
& Multitest MT8589 / 8305L
•Package Type : TSOP , PLCC, PDIP, SOJ
•Temperate : Room temp to 130oC
•2 test site handling
•Superiority throughput and
reliability
Probing Station
&TSK UF200 / UF200AL
•Wafer Thickness 150 to 1000μm
•Wafer Size 5 , 6 , 8 Inches
•Total Accuracy : 5μm
•Wafer Mapping
•Networking
•Hot temp |
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