Visitors Number
Full Range of Test Service
Engineering Service
Developing Test Capability
Currently available solution
Testing Equipment Forecast
Testing Equipment list

Testing Service
 
Full Range of Test Service
  Production Testing :
  •Wafer Sort (CP)
  •Final Test
  •Lead/Ball/Mark Scan
  •Dry-Bake & Packing
  •Engineering Services
  •IC Characterization program develop
Back-End Turn-Key / Subcontract :
  •Assembly,Burn In,Marking, Dice Saw, tape & real
 
Engineering Service
 
  • Test strategy consultant
  • Test program development
  • Test platform conversion
  • Test performance optimization
  • Multi site test upgrade
  • Detail effective low yield analysis
Developing Test Capability
 
  • vHigh pin count up to 400 (512 available)
    Fx    - Giga bit MAC : BGA388(35*35)
    Axx - Blue Tooth : TFBGA 96(10*10 0.8mm)
  • High speed up to 200MHz (400Mbit available)
    Ixxx    - 133MHz
    Sxxx   - Network Processor : 200MHz
    Pxxxx - USB2.0 : 480M bit
    Axxx  - LVDS controller : 560M bit
    Fx       - Giga bit transceiver controller : 1.25G bit
Currently Available Solution
 
PACKAGE   Pin count    
DIP 300mil 8 14 16 20
DIP600mil 28 40    
PLCC 32 44    
TSOP II 40 44 54  
SSOP 330 20      
QFN 4x4 24      
QFN 4x6 40      
QFN 4.5x6.5 46      
QFN 5x5 28 32    
QFN 6x6 48      
QFN 7x7 32 48 64  
QFN 8x8 56 68    
PACKAGE   Pin count    
QFP 14x20 64 80 100 128
QFP 28x28 160 208 256  
QFP 24x24 208      
LQFP 20x20 144 160 176  
LQFP 24x24 160 176 216  
LQFP 14x20 100 128    
T/LQFP 7x7 32 48 64  
T/LQFP10x10 44 64 80  
LQFP 14x14 100 128    
         
PACKAGE   Pin count    
BGA 4.5x6.5 54      
BGA 7x7 81      
BGA 8x8 64 100    
BGA 9x9 100      
BGA 10x10 144      
BGA 11x11 186      
BGA 12x12 144 256    
BGA 13x13 308      
BGA 13x15 165      
BGA 14x22 119 209    
BGA 15x15 278      
BGA 15x17 165      
BGA 16x16 100~209      
BGA 17x17 256 208    
BGA 20x20 176      
BGA 23x23 300      
BGA 27x27 256~380      
BGA 35x35 388~436      
 
Testing Equipment Forecast
 
Time 2017 2018 Total
Tester Model Q4 Q1 Q2 Q3
Credence SC Series 35       35
Inovys ZFP 1       1
Credence D-10 6       6
Chroma 3600 6       6
Chroma 3360P 6       6
LTX Fusion CX 1       1
ASL1000 4       4
TR6850 4       4
S50 1   1   2
Total Tester 64 64 65 65 65
ESI-9350(LaserTrim) 2       2
Handler 35       35
Prober 22     2 24
Total
(Handler&Prober)
59 59 59 61 61
 
Testing Equipment list
  Tester
  & Credence SC Series

   •50/85MHz digital clock rate
   •256 ( Max 304 ) I/O Channels
   •2M/4M Vector Memory
   •128Mb Scan Memory
   •Analog pin card
  & Inovys ZFP
   •Speed: 50Mhz / 100Mhz
   •Pin Count: 512Pin.(64*8)
   •Pattern memory: 16M
   •DPS 105ch,(0~3V 16A),(0~6V 2.5A),(0~16V 0.2A)
   •PMU 8ch,-2~5V range,+-40mA range
      & Credence D-10
   •100MHz clock rate
   •200Mbps data rate (Max.)
   •288 / 384 digital channel (576 channel Max.)
   •16M pattern memory / 768M max scan depth
             (1 pin/board)
   •16 sets DPS
         •AWG : 8 signal-ended or 4 differential
             with 20bits / 300Msps
         •DIG : 4 differential with 16bits / 2.5Msps
            and 14bits / 100Msps
      & Chroma 3600
   •50/100MHz / 256Pin
   •16M Pattern memory
   •Over timer accuracy 850ps
   •DPS 8ch (+/- 8V, 2A)(+/- 16V, 0.8A)
   •PMU 4ch
         •ADDA 4ch /16bit
   •ALPG 12X, 12Y, 32D
      & Chroma 3360P
   •Test rate 50MHz 256pin (32*8)
   •Over timing accuracy +/- 1.25ns
   •8M pattern memory (option 16M)
   •DPS 8ch (+/-10V, 2A)
   •Option UVI 16ch (+/- 10V, 500mA)
         •PMU 16ch
   •PPMU per pin
   •ALPG 16X, 16Y, 16D
         •ADDA 4AWG(16bit) / 4Digizer (16bit)
      & LTX Fusion CX
   •80MHz clock rate
   •Patern Gen. rate 33MHz
   •128 digital channel (8M pattern memory)
   •OVI 8ch (+/- 16V, 1A)
   •VI16B 16ch (+16 to - 4V, 100mA)
         •AWG:2ch with 14bits / 25Msps
   •DIG:2ch with 14bits / 25Msps
   •RF16:16ports (10MHz to 6GHz)
      & ASL1000
   •14Mhz clock rate
   •Instrument list:
         OVI:±15V range
               DVI:±45V force range, differential
                    voltage measure capable
               MUX:Voltage range 200V / 500V
               TMU:Timing range of 2s to 10ns
               PV3:Fully floating output
               DDD:320 KHz to 14 MHz
               ACS:Simple waveform generator
      & TR6850
   •OVC:8 ch, ±20V renge, ±200mA range
   •QVC:4 ch, ±45V renge, ±1A range
   •PEB32:32 ch, 33Mhz, 4M pattern Memory,
                         Level set -2~8V ±40mA range
   •TMU:4 Set (A,B,HiZ,Trig 4ch/set),
                      625ps resolution, 80ch UR control bit
  & S50
   •LOGIC *1:
               64ch (8PMU), 50Mhz, 17M Pattern memory,
               -2~7V range.2DPS, 10V range, 1.73A range.
               1TMU, -2~10V range, 5ns resolution.32CBIT,
               5V, 60mA.
   •OPM *3:
               8 ch, -15~38V renge, ±1A range.32CBIT,
               5V, 60mA.
  & ESI-9350(Laser Trim)
   •Wavelength:1.3 μm (IR)
   •Maximum Laser Pulse Equalization Rep Rate:6 KHz
   •Programmable Spot Size:2.3 μm ~ 6.0 μm
   •Maximum setting of Energy level per pulse:6.0 μj
   •Size of Wafer:150 mm ( 6”) & 200 mm ( 8”)
Handler
  & NS-5000, NS-6000
   •Package type:QFP, TQFP, TSOP, SOP,
            PLCC, BGA, µ BGA, CSP
   •Temperate:50 to 90oC (Option:90 to 130oC)
   •Up to 2 test site handling
   •Superiority throughput and reliability
  &Hitachi

   •Package type:QFP, TQFP, TSOP, SOP,
            PLCC, BGA, µ BGA, CSP
   •Temperate:50 to 90oC(Option:90 to 130oC)
   •Up to 4 test site parallel testing
         •Superiority throughput and reliability
  & Multitest MT8589 / 8305L
   •Package Type : TSOP , PLCC, PDIP, SOJ
   •Temperate : Room temp to 130oC
   •2 test site handling
         •Superiority throughput and reliability
Probing Station
  &TSK UF200 / UF200AL

   •Wafer Thickness 150 to 1000μm
   •Wafer Size 5 , 6 , 8 Inches
   •Total Accuracy : 5μm
   •Wafer Mapping
   •Networking
         •Hot temp
 

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